@InProceedings{SilvaJúniorRossUeda:2015:PIBaPr,
author = "Silva J{\'u}nior, Ataide Ribeiro da and Rossi, Jos{\'e} Osvaldo
and Ueda, M{\'a}rio",
affiliation = "{Instituto Nacional de Pesquisas Espaciais (INPE)} and {Instituto
Nacional de Pesquisas Espaciais (INPE)} and {Instituto Nacional de
Pesquisas Espaciais (INPE)}",
title = "PIII in batch processing mode using HV Blumlein pulser with pulse
extended to the microsecond range",
booktitle = "Proceedings...",
year = "2015",
organization = "IEEE International Power Modulator and High Voltage Conference
(IPMHVC 2014)",
keywords = "batch processing, HV Blumlein pulser, metal ceramic interface,
plasma immersion ion implantation.",
abstract = "In this work, high-energy PIII process is used to solve the
problem of soldering terminals to silver film electrodes without
compromising their adhesion to ceramic substrates in electronic
components such as ceramic capacitors. Besides, PIII
batch-processing mode is other important technique used to
optimize the treatment of metallic and polymeric surfaces for
industrial applications such as components with rigid
qualification used in the aerospace industry. For this, a sample
holder made of stainless steel (SS304) with the shape of a cage
allows applying the PIII processing on both faces of the flat
components, simultaneously. As the batch-mode process requires
increased pulse duration, the redesign of a HV Blumlein pulser was
made to increase the pulse duration from 1.0 \μs to 5.0
\μs, but at the cost of decreasing the output voltage from
60 kV during treatment to less than 20 kV. The longer pulse
duration permits deeper penetration of ions into the material
surface.",
conference-location = "Santa Fe, USA",
conference-year = "1-4 June",
urlaccessdate = "11 maio 2024"
}